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MEDIUM POWER PHEMT MMIC * FEATURES 18 GHz to 24 GHz Frequency Band 19 dB Gain 23 dBm Output Power at Saturation 14 dB Input/Output Return Loss +4 V Dual Bias Supply
LMA417
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DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA417 is a 3-stage medium power PHEMT amplifier that provides 19dB linear power gain with 1-dB gain compression power output of greater than +21dBm for commercial mm-W (millimeter-wave) 18 & 23GHz PCN/PCS and 20GHz SatCom application. Ground is provided to the circuitry through vias to the backside metallization.
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ELECTRICAL SPECIFICATIONS @ TAmbient = 25C
(VDD = +4.0V, ZIN = ZOUT = 50) Parameter Small Signal Gain Symbol S21 Test Conditions 60% IDSS Operating Frequency 180.5 GHz 200.5 GHz 230.5 GHz 24.5-26.5 GHz Saturated Drain Current Small Signal Gain Flatness Power at 1-dB Compression Power at Saturation Input Return Loss Output Return Loss Reverse Isolation IDSS S21 P-1dB PSAT S11 S22 S12 60% IDSS 18-24 GHz 24-26.5 GHz 165 Min 18 17 17 Typ 19 18 18 18 360 1 1.5 21 23 -14 -14 -48 495 Max Units dB dB dB dB mA dB dB dBm dBm dB dB dB
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 03/23/01 Email: sales@filss.com
MEDIUM POWER PHEMT MMIC * ABSOLUTE MAXIMUM RATINGS
Parameter Drain Voltage Gate Voltage Operating Current RF Input Power Total Power Dissipation Channel Operating Temperature Storage Temperature Maximum Assembly Temperature (1 min. max.) Notes: * * * Symbol VD VG IOP PIN PTOT TCH TSTG TMAX Test Conditions TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C TAmbient = 22 3 C -- -- -65 Min Max 7 -1 495 15 3.5 150 165 300 Units V V mA dBm W C C C
LMA417
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Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Recommended Continuous Operating Limits should be observed for reliable device operation. Power Dissipation defined as: PTOT (PDC + PIN) - POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 03/23/01 Email: sales@filss.com
MEDIUM POWER PHEMT MMIC * ASSEMBLY DRAWING
LMA417
Notes: * * * *
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. The recommended die attach is a eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290C. Bond on bond or stitch bond acceptable. Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845 Fax: (408) 970-9950
http:// www.filss.com
Revised: 03/23/01 Email: sales@filss.com
MEDIUM POWER PHEMT MMIC * MECHANICAL OUTLINE
LMA417
Notes: * * * *
All units are in microns (m). All bond pads are 100 X 100 m 2 . Bias pad (VDD ) size is 100 X 121.5 m 2 . Unless otherwise specified.
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HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.
Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 03/23/01 Email: sales@filss.com

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